Micron announces its UFS 4.1 and UFS 3.1 storage chips based on G9 architecture
Today Micron announced the world's first G9-based UFS 4.1 and UFS 3.1 storage solutions for smartphones, enabling more on-device AI features. The new storage chips will be available on flagship products shortly after Micron's 1y LPDDR5X chips, which will be available in early 2026.
The UFS 4.1 and UFS 3.1 mobile storage chips are based on Micron's G9 process node and offer improved power efficiency and read/write speed. Capacities will vary between 256GB and 1TB chips and will be suitable for ultra-thin and foldable smartphones.
But in addition to the hardware improvements, Micron promises some software tweaks that would boost user experience and improve the performance of some AI tasks. For instance, the UFS 4.1 storage solutions support Zoned UFS, improving the read-write efficiency and reducing write amplification, while Data defragmentation improves the data relocation and defragmentation inside the UFS device by 60%. Pinned WriteBooster enables faster access to data that is located on the WriteBooster buffer by up to 30%. And the Intelligent latency tracker automatically debugs by analyzing latency logs. That last feature is also available on the UFS 3.1, while the others seem to be exclusive to UFS 4.1 chips.