First evidence that the Tensor G5 will be fabbed by TSMC uncovered
All Tensor chipsets so far and the upcoming Tensor G4 have been based on Exynos chips and fabbed by Samsung. But Google has been working on an in-house design and will reportedly move away from Samsung’s foundries.
A trading record provides the first proof that the Tensor G5 will be fabbed by TSMC instead. The G5 will be used in the Pixel 10 series in late 2025, if all goes well. This information was discovered by Android Authority, who created this handy chart to explain all the abbreviations:
This is the where the information comes from, shipping details for G5 chips for testing. Note that A0 is the first stepping, so it will be tested for issues and not what will be in retail units (there’s at least a year until we get to that point). Also, notice the name Tessolve – the company describes itself as an “end-to-end solution provider, from chip design, test, & PCB engineering”.
The first evidence that the Tensor G5 will be fabbed by TSMC
Google has not moved away from Samsung completely, the 16GB of RAM are manufactured by Samsung Electronics Co. (i.e. SEC). The Pixel 9 series is supposed to be the first generation to feature a 16GB RAM option (series 8 and earlier topped out at 12GB).
Why is the chipset tied so closely with the RAM? That’s because of “InFO_PoP”, i.e. Integrated Fan-Out Package on Package, which is TSMC technology for grafting the RAM on top of the chipset:
InFO_PoP makes for thinner packaging (1.16mm in this case) and has improved electrical and thermal properties too.
The Tensor G4, coming later this year, promises to better heat management and power efficiency than the G3. Whether or not that pans out, the G5 is a major redesign, so the G4’s performance might mean very little for how the G5 will do.
