Big leak details specs for Google Tensor G5 and G6
Ever since their inception, Google Tensor chipsets were based on Exynos chips and fabbed by Samsung. That’s expected to change with next year’s Tensor G5 as Google is expected to make the switch to TSMC’s process node. Android Authority shared an extensive report hailing directly from Google’s gChips division, which details what’s to come from the Tensor G5 and G6 SoCs.
Tensor G5 (codenamed “laguna”) will power the upcoming Pixel 10 series and will be manufactured on TSMC’s 3nm-class N3E process. That’s the same node used for Apple’s A18 Pro chip inside the iPhone 16 Pro series and arguably the leading process node at the moment.
Tensor G6 (codenamed “malibu”) is expected to be fabbed on TSMC’s upcoming N3P node. While still a 3nm process, it will offer substantial gains in performance, power efficiency and size. Based on a leaked document, N3P will offer a 5% jump in frequency compared to N3E while also being capable of drawing 7% less power and taking up 4% less surface area.
